Shenzhen Hiner Technology Co.,LTD.

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Precision And Advanced 300mm FOSB Front Opening Shipping Box Wafer Carrier

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Precision And Advanced 300mm FOSB Front Opening Shipping Box Wafer Carrier

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Brand Name :Hiner-pack
Model Number :FOSB-HN300mm/12 Inch
Place of Origin :China
Certification :ISO 9001 ROHS
MOQ :50PCS(Negotiable)
Price :Prices vary with delivery methods and quantities
Packaging Details :Twice Inner Bag
Delivery Time :2~3 Weeks
Payment Terms :100% Prepayment
Supply Ability :TBC
Coincidence :Automation Equipment
Clean :USC(ultrasonic cleaning)
Material :Main Plastic
Remark :Secondary Recycling
Shape :Standrad
Size :300mm
Capacity :25PCS
Packaging :Clean Bag And Carton
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Product Description:

Precision And Advanced 300mm FOSB (Front Opening Shipping Box) Wafer Carrier

A FOSB (Front Opening Shipping Box) wafer carrier is a specialized container used in the semiconductor industry for the safe transportation and storage of silicon wafers.

Here are some key features and benefits of FOSB wafer carriers:

Key Features

Design: FOSBs are designed with an opening at the front, allowing easy access to the wafers while minimizing contamination risks.

Material: Typically made from cleanroom-compatible materials, such as polypropylene or other plastics, to ensure they do not introduce contaminants.

Capacity: They can hold multiple wafers in a vertical or horizontal orientation, depending on the design, which helps in optimizing space.

Protection: FOSBs provide mechanical protection to wafers during transport, reducing the risk of breakage or damage.

Compatibility: They are designed to be compatible with automated handling systems, facilitating seamless integration into manufacturing processes.

Features:

To ensure proper sanitation, it is important to clean the door and shell after each use. The door gasket and wafer cushion should also be inspected and replaced when necessary.

Finally, inspections of the FOSB should be conducted for any possible damage or excessive wear before it is re-used.

Technical Parameters:

Benefits
Contamination Control: The design minimizes exposure to airborne particles, ensuring that wafers remain clean.
Efficiency: The front-opening feature allows for quick loading and unloading,
Improving workflow in semiconductor fabrication facilities.
Standardization: FOSBs are often designed to meet industry standards,
making them interchangeable between different manufacturers and systems.
Applications(FOSB wafer carriers are primarily used in)
Semiconductor fabrication plants (fabs)
Wafer testing facilities
Research and development labs

Precision And Advanced 300mm FOSB Front Opening Shipping Box Wafer Carrier

Support and Services:

Technical Support and Service for 300mm FOSB:

Pre-sales support: Providing customers with product information, introduction, specifications and other pre-sales services.

Installation support: Assisting customers in product installation, commissioning and debugging.

After-sales service: Regular maintenance and repair, providing customers with professional advice.

Training services: Training service personnel and customers to use the product correctly.

Warranty: Providing a 12-month warranty period for the 300mm FOSB.

Precision And Advanced 300mm FOSB Front Opening Shipping Box Wafer Carrier
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