Shenzhen Hiner Technology Co.,LTD.
The Pioneer Of R&D and Application In Semiconductor Carrier Products
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Wafer Foam is a specially designed foam cushion pad that provides excellent shock absorption and wafer protection during transportation and storage. The cushioning properties of this product make it an ideal choice for handling delicate wafers and preventing damage caused by impact and vibration.
The product is named Foam Cushion Pad due to its cushioning properties and its function as a protective pad for wafers. The foam material provides gentle and uniform support, reducing the risk of damage to the wafers during transportation and storage.
| Parameter | Value |
|---|---|
| Name | Foam Cushion Pad |
| Brand | Hiner-pack |
| Surface Resistance*1 | 1.0*10E4~1.0*10E11Ω |
| Shape | Round |
| Property*2 | Good Shock Resistance |
| Property | Avoid Corrosion |
| Durability | High |
| Origin | China |
| Color | Pink |
| Material | ESD Polymer And PP Foam Material |
| Key Features | Description |
|---|---|
| Different Thicknesses Are Available | This foam cushion pad comes in various thickness options to suit different needs and preferences. |
| ESD Function | This product has an ESD function to prevent the build-up of static electricity and protect sensitive electronic components. |
| Match In The Wafer Shipping Box | The foam cushion pad is designed to fit perfectly in a wafer shipping box, ensuring secure and stable transportation of wafers. |