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Parameter | Description |
---|---|
Cleanliness | General And Clean Room Use Optional |
Property | ESD Or Non-ESD |
Capacity | 10~25PCS(Depends On Chip Thickness) |
Shape | Round |
Material | Natural Or Conductive PP |
Product Name | Wafer Jars |
Depth | 22.86~76.2mm |
Method | Directly Open The Lid |
Advantage | Reduce Wafer Friction |
Color | Black,Clear,White Lid |
Light-weight | Yes |
Multi-buffering | Yes |
PP Material | Yes |
Equipment Maintenance and Replacement: During equipment maintenance or replacement, safely transport spare or repair wafer.